Cleaning Process and Application
Oxidation Process and Application
Thin Film Deposition Process and Application
Packaging Process and Application
Polishing Process and Application
Other Processes and Applications
Cleaning Process and Application
Wafer Cleaning
Process Gases: HF, H₂SO₄, SC1 (NH₄OH/H₂O₂), SC2 (HCl/H₂O₂)
Equipment Application
Wet Station: Removing acid/alkali vapor, preventing cross-contamination
RCA Cleaning Tank: Extracting NH₄OH and HCl mixed gases
Wet Station: Removing acid/alkali vapor, preventing cross-contamination
RCA Cleaning Tank: Extracting NH₄OH and HCl mixed gases
Fan Requirements
Materials: PP/PVDF (HF-resistant), FRP (acid/alkali-resistant)
Explosion-Proof: ATEX certification (H₂O₂ explosive)
Low Vibration: Preventing wafer surface damage
Materials: PP/PVDF (HF-resistant), FRP (acid/alkali-resistant)
Explosion-Proof: ATEX certification (H₂O₂ explosive)
Low Vibration: Preventing wafer surface damage
Thin Film Deposition Process and Application
Chemical Vapor Deposition (CVD)
Process Gases: SiH₄, NH₃, WF₆, TEOS
Equipment Application
CVD Equipment: Remove unreacted corrosive gases and cools the chamber
CVD Equipment: Remove unreacted corrosive gases and cools the chamber
Fan Requirements
Explosion-Proof Design: SiH₄ is flammable and explosive
Particle Resistance: Prevents buildup of by-products (e.g., SiO₂ powder)
Cooling Efficiency: Ensures stable chamber temperature
Explosion-Proof Design: SiH₄ is flammable and explosive
Particle Resistance: Prevents buildup of by-products (e.g., SiO₂ powder)
Cooling Efficiency: Ensures stable chamber temperature
Packaging Process and Application
Curing Oven
Process Gases
Photoresist curing gases, formaldehyde, VOCs, pyrolysis products (CO, NOₓ)
Photoresist curing gases, formaldehyde, VOCs, pyrolysis products (CO, NOₓ)
Equipment Application
Removes PGMEA/DNB vapor from photoresist curing, maintaining airflow uniformity
Removes PGMEA/DNB vapor from photoresist curing, maintaining airflow uniformity
Fan Requirements
Explosion-Proof Design: Some solvent vapors (e.g., IPA) are flammable
Temperature Resistance: Withstands high temperatures
Low Leakage: Maintains chamber vacuum integrity
Explosion-Proof Design: Some solvent vapors (e.g., IPA) are flammable
Temperature Resistance: Withstands high temperatures
Low Leakage: Maintains chamber vacuum integrity
Polishing Process and Application
CMP (Chemical Mechanical Polishing)
Process Gases:
NH₄OH, H₂O₂, SiO₂ slurry volatiles
NH₄OH, H₂O₂, SiO₂ slurry volatiles
Equipment Application
Post-Polishing Cleaner: Remove slurry volatile gases Slurry Recovery System: Treat ammonia-containing exhaust
Post-Polishing Cleaner: Remove slurry volatile gases Slurry Recovery System: Treat ammonia-containing exhaust
Fan Requirements
Resistant to oxidizers (H₂O₂ is highly oxidative)
Resistant to oxidizers (H₂O₂ is highly oxidative)
Other Processes and Applications
Exhaust Gas Treatment Systems
Treated Gases
Acidic exhaust (HF, HCl), VOCs (photoresist solvents)
Acidic exhaust (HF, HCl), VOCs (photoresist solvents)
Equipment Application
Compact Wet Scrubber: Require acid-resistant fans
Combustion Treatment: Handle high-temperature corrosive gases
Compact Wet Scrubber: Require acid-resistant fans
Combustion Treatment: Handle high-temperature corrosive gases
Fan Requirements
Fully corrosion-resistant structure (PP/PTFE materials)
Fully corrosion-resistant structure (PP/PTFE materials)
