Wafer Cleaning
Wet Station: Removing acid/alkali vapor, preventing cross-contamination
RCA Cleaning Tank: Extracting NH₄OH and HCl mixed gases
Exhaust Gas Cleaning for Core Equipment such as Etching, Physical Deposition, and Ion Implantation
Plasma Etcher: emit corrosive by-products (e.g., AlCl₃, SiF₄) Wet Etch Stations: extract and exhaust mixed acid vapors of HF/HNO₃
Chemical Vapor Deposition (CVD)
CVD Equipment: Remove unreacted corrosive gases and cools the chamber
Curing Oven
Photoresist curing gases, formaldehyde, VOCs, pyrolysis products (CO, NOₓ)
Removes PGMEA/DNB vapor from photoresist curing, maintaining airflow uniformity
CMP (Chemical Mechanical Polishing)
NH₄OH, H₂O₂, SiO₂ slurry volatiles
Post-Polishing Cleaner: Remove slurry volatile gases Slurry Recovery System: Treat ammonia-containing exhaust
Exhaust Gas Treatment Systems
Acidic exhaust (HF, HCl), VOCs (photoresist solvents)
Compact Wet Scrubber: Require acid-resistant fans
Combustion Treatment: Handle high-temperature corrosive gases